Car Body structure (BIW): Honda/Acura
Thanks to the generosity of Honda Research & Development Americas, Inc. (HRA), the Department of Mechanical and Aerospace Engineering has received a customized 2014 Acura TLX frame to be used in teaching and research.
The color-coded vehicle frame.The HRA facility in Raymond, OH, a close partner of the department, used a production TLX to create a one-off display in order to expose core body frame components made suitable for design education. Design specifications were created by HRA engineers, who contracted with the university’s Center for Design and Manufacturing Excellence for final preparation of the display.
The department’s Digital Design and Manufacturing Laboratory houses the vehicle frame, which is color-coded to indicate its different materials. Under the direction of Jami Shah, Honda Professor of Engineering Design, it will be used to inform research aimed at improving vehicle structures.
“The TLX frame will be a great educational resource for teaching and research in structural design, topology optimization, materials and joining technology for lightweight structures,” said Shah. “It will allow students to get a detailed and up-close look at automotive frame structures, one of my lab’s research areas.”
Since being designated as the Honda Professor of Engineering Design three years ago, Shah has spent one day per week at HRA in the Strategic Research Area. There, he’s able to collaborate with engineers, access CAD files and develop research projects of mutual interest.
The relationship has also been instrumental in developing new mechanical engineering courses taught by Shah, which will utilize the vehicle frame donation.
“HRA engineers have been a big part of helping me with the development of new courses in advanced CAD and finite element analysis,” said Shah, who teaches both undergraduate and graduate students. “The TLX will benefit students enrolled in these classes, helping them conceptualize key elements of vehicle structures.”
Division Director of Strategic Research Operations and Chief Engineer at HRA Duane Detwiler (BS AE, MS AE) described the significance of the donation. “Honda values practical hands on education, and our collaboration with Professor Shah continues to be extremely successful in producing students that are sought-after as recruits by many Honda Engineering Divisions.”
Coordinate Measuring Machine (CMM)
The FARO Design ScanArm is a portable lightweight 3D scanning solution. It is developed for so you can reverse engineer legacy parts to design changes or replacement, create digital libraries to decrease inventory and warehouse costs, design aesthetically pleasing free form surfaces or leverage the power of rapid prototyping. It can also be used fro inspection and metrology of manufactured parts.
Below is the lst of uses for this machine:
- Capture and digitize objects and props in full realistic detail for digital visualization
- Manufacture parts without existing CAD models
- Develop aftermarket products that need to fit tightly with existing products
- Digital archiving and historical preservations
- Reverse engineer legacy parts for design changes or replacement
- Create digital libraries to decrease inventory and warehouse costs
- Design aesthetically pleasing, freeform surfaces
- Leverage the power of rapid prototyping
SLA parinter: Form2 by formlabs
The Form 2 delivers high-resolution parts that can be printed with 20 different materials. In our lab wehave four different material including flexible and Dental Material.
Stereolithography (SLA) 3D printing uses a laser to cure solid isotropic parts from a liquid photopolymer resin.
FDM printer: lulzbot Taz2
Fused Deposition Modeling (FDM), is a 3D printing process that uses a continuous filament of a thermoplastic material. the specifications of thie machin we ave are lsited below:
Print Technology: Fused Filament Fabrication
Print Dimensions: Dimensions 280 mm x 280 mm x 285 mm (11.02 in x 11.02 in x 11.22 in)
Print Volume: 22,344 cm³ (1,362.56 in³)
Ambient Operating Temperature: From 5°C to 45°C (41°F to 113°F)
Connectivity: USB Serial or SD Card with Included 8gb SD Card
Unit Weight: 6.78 kg (37 lbs) without filament spool
Nozzle Diameter: 0.50 mm
Nozzle Material: Hardened Steel
Nozzle Temperature: Up to 290°C (554°F)
Nozzle Heatup Time: From 18°C to 230°C (64°F to 446°F) in 1 minute, 36 seconds
Print Surface: Modular Heated Borosilicate Glass/PEI
Maximum Print Bed Temperature: Up to 120°C (248°F)
Layer Resolution: 0.05mm-0.4mm (0.002"-0.015")
Minimum Positive Feature Size: 0.5 mm (0.02 in)
Calculated XYZ positional resolution: 10, 10, <1 microm
Filament Diameter: 2.85 mm
Supported Materials: Open filament system compatible with PLA, ABS, Nylon, Polycarbonate, Carbon Fiber Reinforced Blends, TPU 85A & 95A (Flexible), PETG, PETT, Copolyester, PVB (Polycast), PVA, HIPS, and many more 3rd party filaments.